Compound formation and bonding configuration at the Si-Cu interface
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چکیده
منابع مشابه
Void formation at the interface in Sn/Cu solder joints
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ژورنال
عنوان ژورنال: Physical Review B
سال: 1983
ISSN: 0163-1829
DOI: 10.1103/physrevb.28.3597